WL HT007 X-17 Series Pre-Heating Groove Mold Desoldering Station for iPhone X-17 ProMax Layered Motherboard Tin Planting Bonding

Name: WL HT007 X-17 Series Pre-Heating Groove Mold Desoldering Station for iPhone X-17 ProMax Layered Motherboard Tin Planting Bonding
SKU: 1005013146536657
Price: 51.61 USD
Availability: InStock

Industrial & Business > Woodworking Machinery & Accessories

51,61 USD (≈ 45,81 €)